US Patent 9736276 Packetized interface for coupling agents
Patent 9736276 was granted and assigned to Intel on August, 2017 by the United States Patent and Trademark Office.
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Patent abstract
In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.
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Patent Inventor Names
Abhishek Singhal0
Jasmin Ajanovic0
Mahesh Wagh0
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US Patent 09736276 Packetized interface for coupling agents US Patent 9736276 Packetized interface for coupling agents
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Patent Number
097362760
Patent Number
97362760
Edits on 24 Sep, 2022
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
097362760
Date of Patent
August 15, 2017
0Patent Application Number
143101640
Date Filed
June 20, 2014
0Patent Primary Examiner
Edits on 14 Jan, 2022
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US Patent 09736276 Packetized interface for coupling agents
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09736276
Date of patent
August 15, 2017
Patent application number
14310164
Date Filed
June 20, 2014
Patent primary examiner
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