Patent attributes
An organic planarization layer (OPL) is formed above a functional layer located on a substrate. A titanium-oxide layer is formed above the OPL, wherein forming the titanium-oxide layer comprises titanium, oxide, carbon, and nitrogen. A photoresist layer is patterned above a first portion of the titanium-oxide layer. A second portion of the titanium-oxide layer is removed using a wet stripping technique. The photoresist layer and the OPL are removed using a dry etch technique, wherein the first portion of the titanium-oxide layer remains over a remaining portion of the OPL. The first portion of the titanium-oxide layer and the functional layer are removed using the wet stripping technique. The remaining portion of the OPL is removed using a dry stripping technique.
