US Patent 9837595 Semiconductor package assembly with thermal recycling function
Is a
Date Filed
May 20, 2015
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Date of Patent
December 5, 2017
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Patent Application Number
14717159
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Patent Inventor Names
Tai-Yu Chen
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Chia-Feng Yeh
0
Chia-Wei Chi
0
Chin-Chiang Chang
0
Long-Kun Yu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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