Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ting-Yu Yeh0
Wei-Ming Chen0
Yi-Chiang Sun0
Date of Patent
February 20, 2018
0Patent Application Number
155816670
Date Filed
April 28, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package structure is disclosed. The semiconductor package structure includes: a substrate having a front surface and a back surface; a chip-on-interposer structure mounted on the front surface of the substrate; a back side stiffener mounted over the back surface of the substrate and surrounding a projection of the chip-on-interposer structure from a back surface perspective; and a plurality of conductive bumps mounted on the back surface of the substrate.
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