US Patent 9899305 Semiconductor package structure
Patent 9899305 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2018 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor package structure is disclosed. The semiconductor package structure includes: a substrate having a front surface and a back surface; a chip-on-interposer structure mounted on the front surface of the substrate; a back side stiffener mounted over the back surface of the substrate and surrounding a projection of the chip-on-interposer structure from a back surface perspective; and a plurality of conductive bumps mounted on the back surface of the substrate.
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Patent Inventor Names
Ting-Yu Yeh0
Wei-Ming Chen0
Yi-Chiang Sun0
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US Patent 09899305 Semiconductor package structure US Patent 9899305 Semiconductor package structure
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Patent Number
098993050
Patent Number
98993050
Edits on 24 Sep, 2022
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
098993050
Date of Patent
February 20, 2018
0Patent Application Number
155816670
Date Filed
April 28, 2017
0Patent Primary Examiner
Edits on 19 Jan, 2022
Golden AI
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US Patent 09899305 Semiconductor package structure
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09899305
Date of patent
February 20, 2018
Patent application number
15581667
Date Filed
April 28, 2017
Patent primary examiner
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