Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 27, 2018
Patent Application Number
15263649
Date Filed
September 13, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure provides methods for packaging a chip and packaged chips in which the chip and packaging are co-planar and gap-less. In certain instances, the packaged chip has electrodes or fluidics integrated with the chip.
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