US Patent 9929065 Low-cost packaging for fluidic and device co-integration
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Patent abstract
The present disclosure provides methods for packaging a chip and packaged chips in which the chip and packaging are co-planar and gap-less. In certain instances, the packaged chip has electrodes or fluidics integrated with the chip.
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US Patent 09929065 Low-cost packaging for fluidic and device co-integration US Patent 9929065 Low-cost packaging for fluidic and device co-integration
Infobox
Patent Number
0992906500
Patent Number
992906500
Edits on 24 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
099290650
Date of Patent
March 27, 2018
0Patent Application Number
152636490
Date Filed
September 13, 2016
0Patent Primary Examiner
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
099290650
Date of Patent
March 27, 2018
0Patent Application Number
152636490
Date Filed
September 13, 2016
0Patent Primary Examiner
Edits on 19 Jan, 2022
Golden AI
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Infobox (+7 properties)
US Patent 09929065 Low-cost packaging for fluidic and device co-integration
Infobox
Is a
Patent jurisdiction
Patent number
09929065
Date of patent
March 27, 2018
Patent application number
15263649
Date Filed
September 13, 2016
Patent primary examiner
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