US Patent 9978735 Interconnection of an embedded die
Patent 9978735 was granted and assigned to Altera on May, 2018 by the United States Patent and Trademark Office.
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Patent abstract
Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.
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Patent Inventor Names
Choong Kooi Chee0
Loke Yip Foo0
Mei See Chin0
Wai Ling Lee0
Wei Lun Oo0
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US Patent 09978735 Interconnection of an embedded die US Patent 9978735 Interconnection of an embedded die
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Patent Number
099787350
Patent Number
99787350
Edits on 24 Sep, 2022
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
099787350
Date of Patent
May 22, 2018
0Patent Application Number
152782890
Date Filed
September 28, 2016
0Patent Primary Examiner
Edits on 20 Jan, 2022
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US Patent 09978735 Interconnection of an embedded die
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09978735
Date of patent
May 22, 2018
Patent application number
15278289
Date Filed
September 28, 2016
Patent primary examiner
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