US Patent 9984954 Phase changing on-chip thermal heat sink
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Patent abstract
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.
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Patent Inventor Names
Mattias E. Dahlstrom0
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US Patent 09984954 Phase changing on-chip thermal heat sink US Patent 9984954 Phase changing on-chip thermal heat sink
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Patent Number
099849540
Patent Number
99849540
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Patent Jurisdiction
Patent Number
099849540
Date of Patent
May 29, 2018
0Patent Application Number
149282060
Date Filed
October 30, 2015
0Patent Primary Examiner
Edits on 20 Jan, 2022
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US Patent 09984954 Phase changing on-chip thermal heat sink
Infobox
Is a
Patent jurisdiction
Patent number
09984954
Date of patent
May 29, 2018
Patent application number
14928206
Date Filed
October 30, 2015
Patent primary examiner
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