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US Patent D1046799 Semiconductor module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 9, 2021
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Date of Patent
October 15, 2024
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Patent Application Number
29807156
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Patent Citations
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US Patent D783550 Power semiconductor device
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US Patent D827591 Semiconductor module
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US Patent D839220 Semiconductor device
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US Patent D845921 Semiconductor device
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US Patent D853342 High-performance semiconductor module
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US Patent D853978 High-performance semiconductor module
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US Patent D859334 Semiconductor device
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US Patent D864884 Semiconductor device
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US Patent 10510626 Method for use in manufacturing a semiconductor device die
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US Patent D873227 Semiconductor device
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Patent Inventor Names
Osamu Shirata
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Yusuke Hidaka
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
D1046799
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Patent Primary Examiner
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Garth Rademaker
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CPC Code
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H01L 21/24
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H01L 21/26
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H01L 21/28
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H01L 21/30
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H01L 21/20
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H01L 21/18
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H01L 29/161
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H01L 29/0696
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H01L 29/1095
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H01L 29/417
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