US Patent D641720 Circuit package lid

Patent D641720 was granted and assigned to Advanced Micro Devices on July, 2011 by the United States Patent and Trademark Office.

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Patent Inventor Names

Nikon Banouvong0

Chia-Ken Leong0

Sanjay Dandia0

Stephen Heng0

Date of Patent

July 19, 2011

Patent Application Number

293584720

Date Filed

March 26, 2010

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