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US Patent D903477 Metal clamp

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
January 24, 2018
Date of Patent
December 1, 2020
Patent Application Number
29634768
Patent Citations
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US Patent 10032792 Semiconductor device and manufacturing method thereof
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US Patent 10043661 Method for protecting layer by forming hydrocarbon-based extremely thin film
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US Patent 10047435 Dual selective deposition
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US Patent 10053774 Reactor system for sublimation of pre-clean byproducts and method thereof
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US Patent 10060473 Energy conversion systems and methods
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US Patent 10083836 Formation of boron-doped titanium metal films with high work function
0
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US Patent 10087522 Deposition of metal borides
0
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US Patent 10087525 Variable gap hard stop design
0
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US Patent 10090316 3D stacked multilayer semiconductor memory using doped select transistor channel
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US Patent 10103040 Apparatus and method for manufacturing a semiconductor device
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
D903477
Patent Primary Examiner
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John R Yeh

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