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US Patent D997892 End effector for handling wafers

Overview Structured Data Issues Contributors Activity

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Kiyoaki Yamada

Tetsuya Marubayashi

Satoshi Aizawa

Date of Patent

September 5, 2023

Patent Application Number

29735896

Date Filed

May 26, 2020

Patent Citations

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US Patent 9349643 Apparatus and method for thin wafer transfer

US Patent 9524897 End handler for film and film frames and a method thereof

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Patent Primary Examiner

Elizabeth J Oswecki

CPC Code

H01L 2224/27002

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