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Vertical Circuits
Vertical Circuits is a Scotts Valley, California-based semiconductor company.
Overview
Structured Data
Issues
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Activity
All edits
Edits on 6 Sep, 2023
"prospector:3163:3602156"
Katrina-Kay Pettitt
edited on 6 Sep, 2023
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-1
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Number of Employees (Ranges)
5 – 9
Number of Employees (Ranges)
1 – 4
Edits on 7 May, 2023
"prospector:2714:3058019"
Katrina-Kay Pettitt
edited on 7 May, 2023
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Wellfound ID
ertical-circuits
Wellfound ID
vertical-circuits
Edits on 6 May, 2023
"Covert AngelList URL to Wellfound ID"
Golden AI
edited on 6 May, 2023
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+1
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Wellfound ID
ertical-circuits
Edits on 3 Feb, 2023
"prospector:2254:2285807"
Katrina-Kay Pettitt
edited on 3 Feb, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Number of Employees (Ranges)
5 – 9
Edits on 18 Jan, 2023
"Edit from table cell"
Semyon Kolychev
edited on 18 Jan, 2023
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(
+1
properties)
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LinkedIn URL
https://www.linkedin.com/company/vertical-circuits/
Edits on 25 Aug, 2022
Bhupendra Solanki
edited on 25 Aug, 2022
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+5
properties)
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NAICS Code
334,220
DUNS Number
102670044
Full Address
10 Victor Square Scotts Valley, CA 95066 United States
Location
Scotts Valley, California
Number of Employees
5
Edits on 10 Jun, 2022
"Entity importer update"
Golden AI
edited on 10 Jun, 2022
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+1
properties)
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Is a
Organization
Edits on 18 May, 2022
Tim D
edited on 18 May, 2022
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+1
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Crunchbase
https://www.crunchbase.com/organization/vertical-circuits
Edits on 8 Apr, 2022
"Patent autocalculation"
Golden AI
edited on 8 Apr, 2022
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+1
properties)
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Patents assigned (count)
9
Edits on 14 Dec, 2021
"Remove inverse infobox"
Golden AI
edited on 14 Dec, 2021
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-7
properties)
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Patents
US Patent 7215018 Stacked die BGA or LGA component assembly
US Patent 7245021 Micropede stacked die component assembly
US Patent 7535109 Die assembly having electrical interconnect
US Patent 7705432 Three dimensional six surface conformal die coating
US Patent 7843046 Flat leadless packages and stacked leadless package assemblies
US Patent 7863159 Semiconductor die separation method
US Patent 7923349 Wafer level surface passivation of stackable integrated circuit chips
Edits on 7 Dec, 2021
Golden AI
edited on 7 Dec, 2021
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Infobox
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+1
properties)
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Patents
US Patent 7923349 Wafer level surface passivation of stackable integrated circuit chips
Golden AI
edited on 6 Dec, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7863159 Semiconductor die separation method
Edits on 6 Dec, 2021
Golden AI
edited on 6 Dec, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7843046 Flat leadless packages and stacked leadless package assemblies
Edits on 4 Dec, 2021
Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7705432 Three dimensional six surface conformal die coating
Edits on 2 Dec, 2021
Golden AI
edited on 2 Dec, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7535109 Die assembly having electrical interconnect
Edits on 22 Nov, 2021
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7245021 Micropede stacked die component assembly
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox
(
+1
properties)
Infobox
Patents
US Patent 7215018 Stacked die BGA or LGA component assembly
Edits on 12 May, 2021
"Funding autocalculation"
Golden AI
edited on 12 May, 2021
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+1
properties)
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Latest funding type
Series B Round
Edits on 28 Mar, 2021
"Found on funding round"
Golden AI
edited on 28 Mar, 2021
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+1
properties)
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Investors
Battery Ventures
Edits on 6 Oct, 2020
"Funding autocalculation"
Golden AI
edited on 6 Oct, 2020
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+1
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Latest funding round date
January 11, 2005
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