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William David Coleman

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Edits on 14 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 14 Dec, 2021
Edits made to:
Infobox (-20 properties)
Infobox
Patent primary examiner of
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US Patent 7105458 Method of etching semiconductor devices using a hydrogen peroxide-water mixture
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US Patent 7223688 Single level metal memory cell using chalcogenide cladding
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US Patent 7227247 IC package with signal land pads
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US Patent 7235419 Method of making a memory cell
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US Patent 7244657 Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
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US Patent 7247504 Ferroelectric capacitor, process for production thereof and semiconductor device using the same
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US Patent 7247879 Semiconductor integrated circuit device having particular testing pad arrangement
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US Patent 7247930 Power management integrated circuit
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US Patent 7250310 Process for forming and analyzing stacked die
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US Patent 7250350 Method and structure for integrated stacked capacitor formation
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US Patent 7250671 Lead frame and method for manufacturing semiconductor package with the same
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US Patent 7256075 Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
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US Patent 7259026 Method and apparatus for processing organosiloxane film
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US Patent 7259032 Hermetically sealing a package to include a barrier metal
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US Patent 7262130 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
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US Patent 7268032 Termination for trench MIS device having implanted drain-drift region
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US Patent 7268033 Method and structure for providing tuned leakage current in CMOS integrated circuits
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US Patent 7274079 Sensor design and process
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US Patent 7335527 Method for microfabricating structures using silicon-on-insulator material
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US Patent 7385220 Fiber having dielectric polymeric layer on electrically conductive surface
Edits on 30 Nov, 2021
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Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7385220 Fiber having dielectric polymeric layer on electrically conductive surface
Edits on 23 Nov, 2021
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7335527 Method for microfabricating structures using silicon-on-insulator material
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7274079 Sensor design and process
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7268033 Method and structure for providing tuned leakage current in CMOS integrated circuits
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7268032 Termination for trench MIS device having implanted drain-drift region
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7262130 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7259032 Hermetically sealing a package to include a barrier metal
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7259026 Method and apparatus for processing organosiloxane film
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7256075 Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7250671 Lead frame and method for manufacturing semiconductor package with the same
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7250350 Method and structure for integrated stacked capacitor formation
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7250310 Process for forming and analyzing stacked die
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7247930 Power management integrated circuit
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7247879 Semiconductor integrated circuit device having particular testing pad arrangement
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7235419 Method of making a memory cell
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7227247 IC package with signal land pads
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7223688 Single level metal memory cell using chalcogenide cladding

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