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Sheila V. Clark

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Edits on 15 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-12 properties)
Infobox
Patent primary examiner of
‌
US Patent 7215004 Integrated circuit device with electronically accessible device identifier
‌
US Patent 7259466 Low temperature bonding of multilayer substrates
‌
US Patent 7342310 Multi-chip package with high-speed serial communications between semiconductor die
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US Patent 7371605 Active organic semiconductor devices and methods for making the same
‌
US Patent 7605453 Chip module and chip card
‌
US Patent 7667308 Leaded stacked packages having integrated upper lead
‌
US Patent 7745898 Multichip package, methods of manufacture thereof and articles comprising the same
‌
US Patent 7851914 Semiconductor integrated circuit device
‌
US Patent 7880277 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
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US Patent 7923819 Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same
‌
US Patent 7989961 Redistribution layer enhancement to improve reliability of wafer level packaging
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US Patent 7999396 Adhesive tape and semiconductor package using the same
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7999396 Adhesive tape and semiconductor package using the same
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7989961 Redistribution layer enhancement to improve reliability of wafer level packaging
Edits on 7 Dec, 2021
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Golden AI
edited on 7 Dec, 2021
Edits on 6 Dec, 2021
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Golden AI
edited on 6 Dec, 2021
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Golden AI
edited on 6 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7851914 Semiconductor integrated circuit device
Edits on 4 Dec, 2021
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Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7745898 Multichip package, methods of manufacture thereof and articles comprising the same
Edits on 4 Dec, 2021
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Golden AI
edited on 4 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7667308 Leaded stacked packages having integrated upper lead
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Golden AI
edited on 3 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7605453 Chip module and chip card
Edits on 26 Nov, 2021
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Golden AI
edited on 26 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7371605 Active organic semiconductor devices and methods for making the same
Edits on 23 Nov, 2021
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7342310 Multi-chip package with high-speed serial communications between semiconductor die
Edits on 22 Nov, 2021
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Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7259466 Low temperature bonding of multilayer substrates
Golden AI profile picture
Golden AI
edited on 22 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7215004 Integrated circuit device with electronically accessible device identifier
Edits on 21 Nov, 2021
"Created via: Entity Importer"
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Golden AI
created this topic on 21 Nov, 2021
Edits made to:
Infobox (+2 properties)
‌

 Sheila V. Clark

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Is a
Person
Person
Current Employer
United States Patent and Trademark Office
United States Patent and Trademark Office

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