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US Patent 10008844 Cable seal

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 15, 2016
Date of Patent
June 26, 2018
Patent Application Number
15555048
Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 12068278 Processed stacked dies
0
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
0
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US Patent 11462419 Microelectronic assemblies
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US Patent 11538781 Integrated device packages including bonded structures
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US Patent 10879226 Stacked dies and methods for forming bonded structures
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US Patent 10896902 Systems and methods for efficient transfer of semiconductor elements
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US Patent 11056390 Structures and methods for reliable packages
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US Patent 11631647 Integrated device packages with integrated device die and dummy element
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10008844
Patent Primary Examiner
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Tremesha S Willis

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