US Patent 10009992 PCB hybrid redistribution layer

A hybrid PCB system has a hybrid redistribution layer that redistributes a large pad-to-pad pitch to a smaller, finer pad-to-pad pitch and applies hybrid materials to balance the thermal-mechanical stress. The hybrid PCB system combines wafer level packaging, IC substrate and high density PCB technologies within a single hybrid PCB. The hybrid PCB system addresses the opportunity for interconnect reliability, design and assembly of a electronic components with pad pitches less than 400 microns directly to a PCB without need of an IC substrate or interposer.