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US Patent 10014239 Information processing device and cooling unit
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Patent
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Date Filed
May 30, 2017
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Date of Patent
July 3, 2018
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Patent Application Number
15607851
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Patent Citations Received
US Patent 11925001 High power density chips based two-phase loop recirculation
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US Patent 10966354 Liquid cooling module
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US Patent 11700709 Redundant module and systems for high density servers
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US Patent 11406041 Modular liquid cooling assembly
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Patent Inventor Names
Mitsutaka Yamada
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Jie Wei
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Keizou Takemura
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Masumi Suzuki
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Michimasa Aoki
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10014239
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Patent Primary Examiner
Robert J Hoffberg
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