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US Patent 10020223 Reduced tip-to-tip and via pitch at line end

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
April 12, 2017
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Date of Patent
July 10, 2018
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Patent Application Number
15485394
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Patent Citations Received
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US Patent 12087624 Beol tip-to-tip shorting and time dependent dielectric breakdown
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US Patent 10685879 Lithographic alignment of a conductive line to a via
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US Patent 11276607 Selective patterning of vias with hardmasks
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US Patent 11682617 High aspect ratio vias for integrated circuits
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US Patent 11328954 Bi metal subtractive etch for trench and via formation
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US Patent 11804406 Top via cut fill process for line extension reduction
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US Patent 11854884 Fully aligned top vias
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Patent Inventor Names
Benjamin D. Briggs
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Brent A. Anderson
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Theodorus E. Standaert
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10020223
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Patent Primary Examiner
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Peniel M Gumedzoe
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