Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae Yong Lee0
Kyoung Yeon Lee0
Min Chul Shin0
Se Man Oh0
Date of Patent
July 10, 2018
0Patent Application Number
152973650
Date Filed
October 19, 2016
0Patent Citations Received
Patent Primary Examiner
0
Patent abstract
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.
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