US Patent 10020263 Semiconductor package and manufacturing method thereof
Patent 10020263 was granted and assigned to Amkor Technology on July, 2018 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 19, 2016
0
Date of Patent
July 10, 2018
0
Patent Applicant
Patent Application Number
15297365
0
Patent Inventor Names
Tae Yong Lee
0
Kyoung Yeon Lee
0
Min Chul Shin
0
Se Man Oh
0
Patent Jurisdiction
Patent Number
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