US Patent 10020263 Semiconductor package and manufacturing method thereof
Patent 10020263 was granted and assigned to Amkor Technology on July, 2018 by the United States Patent and Trademark Office.
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Patent abstract
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.
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Patent Inventor Names
Kyoung Yeon Lee0
Min Chul Shin0
Se Man Oh0
Tae Yong Lee0
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Patent Citations Received
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
100202630
Date of Patent
July 10, 2018
0Patent Application Number
152973650
Date Filed
October 19, 2016
0Patent Citations Received
Patent Primary Examiner
0
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Patent Citations Received
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Patent citations received
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US Patent 10020263 Semiconductor package and manufacturing method thereof
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10020263
Date of patent
July 10, 2018
Patent application number
15297365
Date Filed
October 19, 2016
Patent primary examiner
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