Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10147641 3D IC method and device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 18, 2017
0
Date of Patent
December 4, 2018
0
Patent Application Number
15653329
0
Patent Citations Received
‌
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
‌
US Patent 11955445 Metal pads over TSV
0
‌
US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
‌
US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
‌
US Patent 12125784 Interconnect structures
0
‌
US Patent 12132020 Low temperature bonded structures
0
‌
US Patent 11515202 3D IC method and device
0
‌
US Patent 11515279 Low temperature bonded structures
0
‌
US Patent 11552041 Chemical mechanical polishing for hybrid bonding
‌
US Patent 10840205 Chemical mechanical polishing for hybrid bonding
•••
Patent Inventor Names
Gaius Gillman Fountain, Jr.
0
Paul M. Enquist
0
Qin-Yi Tong
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
10147641
0
Patent Primary Examiner
‌
David Vu
0

Find more entities like US Patent 10147641 3D IC method and device

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo