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US Patent 10155309 Wafer handling robots with rotational joint encoders

Patent 10155309 was granted and assigned to Lam Research on December, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Lam Research
Lam Research
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Date Filed
November 16, 2017
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Date of Patent
December 18, 2018
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Patent Applicant
Lam Research
Lam Research
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Patent Application Number
15815325
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Patent Citations Received
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US Patent 11937890 Direct drive for mechanical arm assembly
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US Patent 11850738 Robotic leg
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US Patent 11850745 Multi-turn drive assembly and systems and methods of use thereof
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US Patent 11850743 Transport apparatus, semiconductor manufacturing apparatus, and transport method
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US Patent 11852982 Semiconductor manufacturing system
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US Patent 11020852 Substrate transport apparatus with independent accessory feedthrough
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US Patent 11602856 Vacuum transfer device and substrate processing system
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US Patent 11776831 Substrate transport system and substrate transport method
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US Patent 11413744 Multi-turn drive assembly and systems and methods of use thereof
Patent Inventor Names
Richard M. Blank
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10155309
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Patent Primary Examiner
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Gerald McClain
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