Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 18, 2018
Patent Application Number
15235106
Date Filed
August 12, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
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