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US Patent 11996372 Semiconductor device and method of manufacture

Patent 11996372 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2024 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

Taiwan Semiconductor Manufacturing Company

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Po-Yao Chuang0

Shin-Puu Jeng0

Po-Hao Tsai0

Date of Patent

May 28, 2024

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Patent Application Number

173726770

Date Filed

July 12, 2021

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Patent Citations

US Patent 10269732 Info package with integrated antennas or inductors

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US Patent 9735118 Antennas and waveguides in InFO structures

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US Patent 10157807 Sensor packages and manufacturing mehtods thereof

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US Patent 10032722 Semiconductor package structure having am antenna pattern and manufacturing method thereof

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Patent Primary Examiner

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CPC Code

H01L 2221/68345

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H01L 2221/68359

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H01L 2224/12105

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H01L 2224/16227

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0

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H01L 2224/32225

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H01L 2224/73253

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Patent abstract

A semiconductor device and manufacturing process are provided wherein a first semiconductor device is electrically connected to redistribution structures. An antenna structure is located on an opposite side of the first semiconductor device from the redistribution structures, and electrical connections separate from the first semiconductor device connect the antenna structure to the redistribution structures.

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