US Patent 11996372 Semiconductor device and method of manufacture
Patent 11996372 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11996372 Semiconductor device and method of manufacture
Article
Patent abstract
A semiconductor device and manufacturing process are provided wherein a first semiconductor device is electrically connected to redistribution structures. An antenna structure is located on an opposite side of the first semiconductor device from the redistribution structures, and electrical connections separate from the first semiconductor device connect the antenna structure to the redistribution structures.
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Po-Hao Tsai0
Po-Yao Chuang0
Shin-Puu Jeng0
Date of Patent
May 28, 2024
0Patent Application Number
173726770
Date Filed
July 12, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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