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US Patent 10157807 Sensor packages and manufacturing mehtods thereof

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Patent Citations Received
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US Patent 11996372 Semiconductor device and method of manufacture
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Patent abstract

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

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US Patent 11600590 Semiconductor device and semiconductor package
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US Patent 11063007 Semiconductor device and method of manufacture
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US Patent 10964652 Semiconductor device package and method of manufacturing the same
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US Patent 10636757 Integrated circuit component package and method of fabricating the same
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US Patent 10636713 Semiconductor packages and manufacturing methods thereof
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 US Patent 10157807 Sensor packages and manufacturing mehtods thereof

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10157807
Date of patent
December 18, 2018
Patent application number
15235106
Date Filed
August 12, 2016
Patent primary examiner
‌
Jose R Diaz

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