Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 18, 2018
Patent Application Number
15290310
Date Filed
October 11, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
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