Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chung-Shi Liu0
Yeong-Jyh Lin0
Hsin-Hung Liao0
Bor-Ping Jang0
Chien Ling Hwang0
Hsiao-Chung Liang0
Date of Patent
December 17, 2019
0Patent Application Number
162228400
Date Filed
December 17, 2018
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
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