Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yeong-Jyh Lin0
Chung-Shi Liu0
Hsiao-Chung Liang0
Jen-Chun Liao0
Bor-Ping Jang0
Chien Ling Hwang0
Date of Patent
April 20, 2021
0Patent Application Number
167156050
Date Filed
December 16, 2019
0Patent Citations
Patent Primary Examiner
Patent abstract
A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and performing a die-saw to separate the device dies and the molding compound into a plurality of packages.
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