US Patent 10985135 Methods for controlling warpage in packaging
Patent 10985135 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 16, 2019
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Date of Patent
April 20, 2021
0
Patent Applicant
Patent Application Number
16715605
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Patent Inventor Names
Yeong-Jyh Lin
0
Chung-Shi Liu
0
Hsiao-Chung Liang
0
Jen-Chun Liao
0
Bor-Ping Jang
0
Chien Ling Hwang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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