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US Patent 10510712 Methods for controlling warpage in packaging
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Patent
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Date Filed
December 17, 2018
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Date of Patent
December 17, 2019
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
16222840
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Patent Citations
US Patent 10157881 Methods for controlling warpage in packaging
Patent Citations Received
US Patent 11004803 Dummy dies for reducing warpage in packages
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US Patent 10985135 Methods for controlling warpage in packaging
Patent Inventor Names
Chung-Shi Liu
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Yeong-Jyh Lin
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Hsin-Hung Liao
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Bor-Ping Jang
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Chien Ling Hwang
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Hsiao-Chung Liang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10510712
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Patent Primary Examiner
Bac H Au
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