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US Patent 10204890 Substrate for system in package (SIP) devices

Patent 10204890 was granted and assigned to Octavo Systems on February, 2019 by the United States Patent and Trademark Office.

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Patent abstract

Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.

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Patent Citations Received
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US Patent 11687472 Interface for semiconductor device and interfacing method thereof
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Edits on 27 Mar, 2023
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Infobox
Is a
Patent
Patent
0
Patent Applicant
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Octavo Systems
0
Current Assignee
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Octavo Systems
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102048900
Date of Patent
February 12, 2019
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Patent Application Number
155039320
Date Filed
August 13, 2015
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Patent Citations Received
‌
US Patent 11416050 Component communications in system-in-package systems
0
Patent Primary Examiner
‌
Duy T Nguyen
0
Edits on 22 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 22 Sep, 2022
"Entity importer update"
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Golden AI
edited on 22 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
‌
Octavo Systems
0
Current Assignee
‌
Octavo Systems
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
102048900
Date of Patent
February 12, 2019
0
Patent Application Number
155039320
Date Filed
August 13, 2015
0
Patent Citations Received
‌
US Patent 11416050 Component communications in system-in-package systems
0
Patent Primary Examiner
‌
Duy T Nguyen
0
Edits on 17 Aug, 2022
"update inverses"
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Golden AI
edited on 17 Aug, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11416050 Component communications in system-in-package systems
Edits on 24 Jan, 2022
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Golden AI
created this topic on 24 Jan, 2022
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 US Patent 10204890 Substrate for system in package (SIP) devices

Infobox
Is a
Patent
Patent
Patent applicant
‌
Octavo Systems
Current assignee
‌
Octavo Systems
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10204890
Date of patent
February 12, 2019
Patent application number
15503932
Date Filed
August 13, 2015
Patent primary examiner
‌
Duy T Nguyen

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