US Patent 10204890 Substrate for system in package (SIP) devices
Patent 10204890 was granted and assigned to Octavo Systems on February, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 13, 2015
Date of Patent
February 12, 2019
Patent Applicant
Patent Application Number
15503932
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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