Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tyler S. Ralston0
Keith G. Fife0
Nevada J. Sanchez0
Susan A. Alie0
Jonathan M. Rothberg0
Date of Patent
March 12, 2019
Patent Application Number
15648187
Date Filed
July 12, 2017
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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