Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jonathan M. Rothberg0
Nevada J. Sanchez0
Susan A. Alie0
Tyler S. Ralston0
Keith G. Fife0
Date of Patent
April 2, 2019
Patent Application Number
15178025
Date Filed
June 9, 2016
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
