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US Patent 10269853 Image sensor device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 19, 2018
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Date of Patent
April 23, 2019
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Patent Application Number
15875067
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Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11462419 Microelectronic assemblies
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US Patent 11538781 Integrated device packages including bonded structures
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US Patent 10847562 Image sensor device
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US Patent 11069734 Image sensor device
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US Patent 11631647 Integrated device packages with integrated device die and dummy element
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US Patent 11764177 Bonded structure with interconnect structure
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US Patent 11387214 Multi-chip modules formed using wafer-level processing of a reconstituted wafer
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US Patent 11855064 Techniques for processing devices
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•••
Patent Inventor Names
Rajesh Katkar
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10269853
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Patent Primary Examiner
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Mark W Tornow
0

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