Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Min Suet Lim0
Bok Eng Cheah0
Jackson Chung Peng Kong0
Date of Patent
June 11, 2019
0Patent Application Number
153542910
Date Filed
November 17, 2016
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A microelectronic device package including multiple layers of stacked die. Multiple die layers in the package can include two or more die. At least two die in a first layer will be laterally spaced from one another to define a first gap extending in a first direction; and at least two die in a second layer will be laterally spaced from one another to define a second gap extending in a second direction that is angularly offset from the first direction. The first and second directions can be perpendicular to one another.
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