Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yun Seok Choi0
Date of Patent
November 29, 2022
0Patent Application Number
170211120
Date Filed
September 15, 2020
0Patent Citations
Patent Primary Examiner
A semiconductor package includes an upper substrate having a first surface and a second surface which are opposite to each other, a lower semiconductor chip disposed on the first surface of the upper substrate, a plurality of conductive pillars disposed on the first surface of the upper substrate at at least one side of the lower semiconductor chip, and an upper semiconductor chip disposed on the second surface of the upper substrate. The lower semiconductor chip and the plurality of conductive pillars are connected to the first surface of the upper substrate, and the upper semiconductor chip is connected to the second surface of the upper substrate.
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