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US Patent 10333623 Optical transceiver

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 25, 2018
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Date of Patent
June 25, 2019
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Patent Application Number
16016657
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Patent Citations Received
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US Patent 12136597 Semiconductor package having an interposer in which one or more dies are formed and method of forming the same
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US Patent 11837582 Molded direct bonded and interconnected stack
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US Patent 11916054 Stacked devices and methods of fabrication
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11977256 Semiconductor package comprising optically coupled IC chips
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US Patent 12068278 Processed stacked dies
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 11545477 Logic drive based on standardized commodity programmable logic semiconductor IC chips
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US Patent 10819345 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
•••
Patent Inventor Names
Chen-Hua Yu
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Ping-Jung Wu
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Wen-Chih Chiou
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Yu-Kuang Liao
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Cheng-Chun Tsai
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Fang-Cheng Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10333623
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Patent Primary Examiner
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Dalzid E Singh
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