Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cyprian Emeka Uzoh0
Belgacem Haba0
Guilian Gao0
Jeremy Alfred Theil0
Rajesh Katkar0
Date of Patent
December 5, 2023
0Patent Application Number
181483270
Date Filed
December 29, 2022
0Patent Citations
0
...
Patent Citations Received
Patent Primary Examiner
Patent abstract
Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.
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