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US Patent 10477729 Receptacle assembly and thermal-transfer assembly

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Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
104777290
Patent Inventor Names
Wenyu Liu0
Hongqiang Han0
Jiwang Jin0
Nikhil Shankar0
Alex Michael Sharf0
Chenxi Wang0
Date of Patent
November 12, 2019
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Patent Application Number
159599730
Date Filed
April 23, 2018
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Patent Citations Received
0
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US Patent 11249264 Thermal optimizations for OSFP optical transceiver modules
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US Patent 11646528 Interface connector
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US Patent 11650384 Thermal optimizations for OSFP optical transceiver modules
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US Patent 11303059 Electrical connector with heat sink securing structure
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US Patent 11357132 Air cooled cage design
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US Patent 11777238 Receptacle assembly, interface card, and electronic device having the same
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US Patent 11774693 Optical transceiver modules and heat management techniques therefor
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Patent Primary Examiner
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Justin M Jonaitis
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Patent abstract

Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.

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