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US Patent 10477729 Receptacle assembly and thermal-transfer assembly

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
April 23, 2018
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Date of Patent
November 12, 2019
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Patent Application Number
15959973
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Patent Citations Received
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US Patent 11249264 Thermal optimizations for OSFP optical transceiver modules
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US Patent 11646528 Interface connector
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US Patent 11650384 Thermal optimizations for OSFP optical transceiver modules
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US Patent 11303059 Electrical connector with heat sink securing structure
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US Patent 11357132 Air cooled cage design
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US Patent 11777238 Receptacle assembly, interface card, and electronic device having the same
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US Patent 11774693 Optical transceiver modules and heat management techniques therefor
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US Patent 11439041 Air cooled cage design
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US Patent 11864353 Heat exchange assembly
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US Patent 10627587 Connector assembly
•••
Patent Inventor Names
Wenyu Liu
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Hongqiang Han
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Jiwang Jin
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Nikhil Shankar
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Alex Michael Sharf
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Chenxi Wang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10477729
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Patent Primary Examiner
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Justin M Jonaitis
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