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US Patent 10514598 Vacuum-integrated hardmask processes and apparatus

Patent 10514598 was granted and assigned to Lam Research on December, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Lam Research
Lam Research
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Date Filed
August 30, 2017
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Date of Patent
December 24, 2019
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Patent Applicant
Lam Research
Lam Research
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Patent Application Number
15691659
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Patent Citations Received
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US Patent 10831096 Vacuum-integrated hardmask processes and apparatus
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US Patent 11257674 Eliminating yield impact of stochastics in lithography
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US Patent 11314168 Underlayer for photoresist adhesion and dose reduction
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US Patent 11764149 Semiconductor device
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US Patent 12062538 Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
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US Patent 12125711 Reducing roughness of extreme ultraviolet lithography resists
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US Patent 12105422 Photoresist development with halide chemistries
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US Patent 11424182 Semiconductor device
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US Patent 11921427 Methods for making hard masks useful in next-generation lithography
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US Patent 11988965 Underlayer for photoresist adhesion and dose reduction
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•••
Patent Inventor Names
Adrien LaVoie
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Artur Kolics
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Bhadri N. Varadarajan
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Dennis M. Hausmann
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George Andrew Antonelli
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Jeffrey Marks
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Richard A. Gottscho
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Sirish K. Reddy
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Thomas Joseph Knisley
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10514598
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Patent Primary Examiner
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Binu Thomas
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