Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 28, 2020
Patent Application Number
16070172
Date Filed
March 30, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A plurality of interconnect features are formed in an interconnect layer on a first insulating layer on a substrate. An opening in the first insulating layer is formed through at least one of the interconnect features. A gap fill layer is deposited in the opening.
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