US Patent 10566261 Integrated fan-out packages with embedded heat dissipation structure
Patent 10566261 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 29, 2018
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Date of Patent
February 18, 2020
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Patent Applicant
Patent Application Number
15940623
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Patent Citations
Patent Inventor Names
Wei-Yu Chen
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Cheng-Ting Chen
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Chia-Lun Chang
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Chia-Shen Cheng
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Chih-Chiang Tsao
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Chih-Wei Lin
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Ching-Hua Hsieh
0
Chung-Shi Liu
0
Hao-Jan Pei
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Hsiu-Jen Lin
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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