US Patent 10573808 Phase change memory with a dielectric bi-layer

Techniques regarding protecting a dielectric material during additive patterning of one or more phase change memories are provided. For example, one or more embodiments described herein can comprise a method, which can comprise forming a bi-layer adjacent a phase change memory element. The bi-layer can comprise a dielectric material and a capping material that can protect a thickness of the dielectric material during a patterning process.