US Patent 10685910 Packages with Si-substrate-free interposer and method forming same

Patent 10685910 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Applicant

Taiwan Semiconductor Manufacturing Company

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

106859100

Date of Patent

June 16, 2020

Patent Application Number

165381790

Date Filed

August 12, 2019

Patent Citations

‌

US Patent 10269768 Stacked integrated circuits with redistribution lines

‌

US Patent 10109613 3DIC stacking device and method of manufacture

‌

US Patent 10319699 Chip package having die structures of different heights

Patent Citations Received

Patent Primary Examiner

‌

Ratisha Mehta

No article content yet.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 10685910 Packages with Si-substrate-free interposer and method forming same

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API